BAV300 thru bav303 switching diodes features ? saving space ? silicon epitaxial planar diodes ? hermetic sealed parts ? fits onto sod-323/sot-23 footprints ? electrical data identical with the devices bav100?bav103 maximum ratings continuous reverse voltage BAV300 bav301 bav302 bav303 v r 50v 100v 150v 200v t a =25 repetitive peak reverse voltage BAV300 bav301 bav302 bav303 v rrm 60v 120v 200v 250v t a =25 forward dc current i f 250ma t a =25 repetitive peak forward current i frm 625ma f=50hz, t a =25 surge forward current i fsm 1.0a t p =1s, t j =25 thermal resistance junction to ambient r thja 500k/w note 2 junction temperature t j 175 storage temperature range t stg -65 to + 175 electrical characteristics @ 25 c unless otherwise specified maximum forward voltage v f 1.00v i f = 100ma ,t a =25 maximum leakage current BAV300 BAV300 bav301 bav301 bav302 bav302 bav303 bav303 i r 100na 15 a 100na 15 a 100na 15 a 100na 15 a v r =50v v r =50v, tj=100 v r =100v v r =100v, tj=100 v r =150v v r =150v, tj=100 v r =200v v r =200v, tj=100 maximum leakage current BAV300 bav301 bav302 bav303 v (br) 60v 120v 200v 250v i r =100 a, t p /t=0.01, t p =0.3ms diode capacitance c d 1.5pf v r =0v, f=1.0mhz maximum reverse recovery time t rr 50ns i f =10ma, i r =30ma i rr =3.0ma, r l =100 ? differential forward resistance r f 5.0 ? i f =10ma revision: a 2011 /01/01 micromelf dimensions inches mm dim min max min max note a .071 .079 1.8 2.0 b .004 .008 .10 .20 c .047 .051 1.20 1.30 ? a b c cathode mark
omponents 20736 marilla street chatsworth !"# $
% !"# mcc 0.030? 0. 039 0.055? suggested solder pad layout tm micro commercial components www. mccsemi .com 1 of 3 ? lead free finish/rohs compliant(note 1) ("p" suffix designates rohs compliant. see ordering information) notes:1.lead in glass exemption applied, see eu directive annex 5. 2.mounted on epoxy-glass hard tissue, fig.4 35 m copper clad, 0.9 mm 2 copper area per electrode moisture sensitivity level 1
fig. 1 reverse current vs. junction temperature fig. 2 forward current vs. forward voltage fig. 3 differential forward resistance vs. forward current 0 40 80 120 160 0.01 0.1 1 10 1000 i - reverse current ( a ) r t j - junction temperature ( c) 200 94 9084 100 scattering limit v r =v rrm 0 0.4 0.8 1.2 1.6 0.1 1 10 100 1000 i - forward current ( ma ) f v f - forward voltage ( v ) 2.0 94 9085 scattering limit t j =25 c 0.1 1 10 1 10 100 1000 r - differential forward resistance ( ) f i f - forward current ( ma ) 100 94 9089 ? t j =25 c fig. 4 board for r thja definition (in mm) 25 2.5 10 0.71 1.3 1.27 9.9 24 0.152 0.355 95 10329 BAV300 thru bav303 mcc revision: a 2011/01/01 tm micro commercial components www. mccsemi .com 2 of 3
mcc revision: a 2011 /01/01 tm micro commercial components www. mccsemi .com 3 of 3 device packing part number-tp tape&reel: 2.5kpcs/reel ordering information : *** i m p o r t a n t n o t ic e * ** m i c r o c o m m e r c i a l c o m p on e n ts c o r p . r e s e rve s t h e r i g h t t o m a k e c h a n g e s w i t ho u t f u r t h e r no t i c e t o a n y p r o d u c t h e r e i n t o m a k e c o rr e c t i o n s , m o d i f i c a t i o n s , e n h a n c e m e n t s , i m pr o v e m e n t s , o r o t h e r ch a n g e s . m i c r o c o m m e r c i a l c o mp o n e n ts c o r p . d o e s n o t a s s u m e a n y l i a b i l i t y a r i s i n g ou t o f t h e a p p l i c a t i on o r u s e o f a n y p r o d uc t d e sc r i be d h e r e i n ; n e i t h e r d o e s i t c o n v e y a n y li c e n s e un der i t s p a t e n t r i g h t s , n o r t h e r i g h t s o f o t h e r s . t h e u s e r o f pr o d uc t s i n s u c h a p p l i c a t i o n s sh a l l a ss u m e a l l r i s k s o f su c h u s e a n d w ill a g r ee t o h o l d m i c r o c o mm er c i a l c o m p o n e n t s c o r p . a n d a ll t h e c o m p a n i e s w ho s e p r o d u c t s a r e r e p r e s e n t ed o n ou r w e b s i t e , h a r m l e s s a g a i n s t a l l d a m a g e s. * * * l i f e s u p p o r t *** m c c ' s pr o d uc t s a r e n o t a u t h o r iz ed f o r u s e a s c r i t i c a l c o m p o n e n t s i n l i f e s u pp o r t d e v i c e s o r s y s t e m s w i t h ou t t h e e x pre ss wr i tt e n a p p r o v a l o f m i c r o c o mm e r c i a l c o m p o n e n t s c o rp o r a t i o n. * * * c u s t o m e r a w a r e n e ss*** c o un t e r f e i t i n g o f s e m i c o n d u c t o r p a r t s i s a gr o w i n g p r o b l e m i n t h e i n d u s t ry . m i c r o c o mm e r c i a l c o m p o n e n t s ( m cc ) i s t a k i n g s t r o n g m e a su r e s t o p r o t e c t ou r s e l v e s a n d o u r cu s t o m e r s f r o m t h e pr o l i f e r a t i on o f c o u n t e r f e i t p a r t s . m c c s t r o n g l y e nc o u r a g e s c u s t o m e r s t o p u r c h a s e m c c p a r t s e i t h e r d i r e c t l y f r o m m c c o r f r o m a u t ho r i z e d m c c d i s t r i b u t o r s w ho a r e l i s t e d b y c o u n t r y o n o u r w e b p a g e c i t ed below . p r o d uc t s c us t o m e r s b u y e i t h e r f r o m m c c d i r e c t l y o r f r o m a u t ho r i z e d m cc d i s t r i b u t o r s a r e g e n u i n e p a r t s , h a v e f ul l t r a c e a b il i t y , m e e t m c c ' s q u a l i t y s t a n d a r d s f o r h a n d li n g a n d s t o r a g e . m c c wi l l n o t p r o v i d e a n y w a rr a n ty c o v e r a g e o r o t h e r a s s i s t a n c e f o r p a r ts b o u g h t f r o m u n a u t h o r i z e d s o u r c e s. m c c i s c o m m i t t e d t o c o m b a t t h i s g l o b a l pr o b l e m a n d e n c ou r a g e o u r c u s t o m e r s t o d o t h e i r p a r t in s t o p p i n g t h i s p r a c t i c e b y b u y i n g d i r e c t o r f r o m a u t h o r i z ed d i s t r i b u t o r s.
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